YangBo Industrial has successfully introduced electroplating technology into its packaging solutions. After years of testing and validation, this process has now reached full-scale production—marking a milestone comparable to Taiwan’s pioneering adoption of in-mold labeling (IML) for inner-layer decoration. Today, we’ve overcome the long-standing bottlenecks of electroplating, unlocking new possibilities for the packaging industry.

Historically, electroplating faced significant challenges in packaging applications. Curved or complex-shaped containers often led to uneven coating thickness, compromising surface consistency and visual appeal. Low surface energy materials such as plastics and composites made adhesion difficult, causing coatings to peel or scratch during transport and stacking—reducing durability and consumer trust. The process itself demands precise chemical additives and current control, where even minor deviations can result in defects and unstable yield rates.

YangBo’s breakthrough directly addresses these pain points. Through advanced process control, material integration, and environmentally friendly solutions, we’ve transformed electroplating from a high-cost experiment into a scalable, differentiated technology. This innovation enhances surface stability while enabling brands to achieve premium finishes—metallic gloss, matte textures, high-shine effects, and diverse visual designs—delivering packaging that is both aesthetically refined and highly durable.

For brands, this is more than a visual upgrade—it’s a strategic leap. Electroplating, combined with IML and injection molding integration, ensures consistent quality in mass production, boosts supply chain efficiency, and supports environmental compliance. It also strengthens brand identity, helping products stand out on shelves and leave a lasting impression with consumers.

Just as YangBo once led the way in IML technology, our electroplating advancement now opens a new chapter for Taiwan’s packaging industry. We believe this breakthrough will become a core differentiator for brands, driving a packaging revolution and establishing new competitive advantages in global markets.